8 часов назад
Senior Staff Engineer, Thermal Simulation
189 000 - 301 000$
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Senior Staff Engineer, Thermal Simulation (Semiconductor Packaging): Leading thermal modeling, analysis, and solution development for semiconductor packages, advanced packaging technologies, and electronic systems with an accent on CFD simulation, electronics cooling, and thermal management. Focus on building detailed Icepak and Flotherm models, validating designs through simulation and measurement, and developing recommendations for high-performance packaging, HBM, and 2.5D/3D integrations.
Location: Daily onsite presence at the San Jose headquarters, United States, with 10–20% domestic and international travel.
Base pay range: $189,000–$301,000 USD annually, plus incentive opportunities.
Company
develops technology solutions for smartphones, electric vehicles, hyperscale data centers, IoT devices, and other advanced applications.
What you will do
- Lead hands-on thermal modeling and analysis for semiconductor packages, advanced packaging, and electronic systems.
- Build and analyze detailed models in ANSYS Icepak and Siemens Flotherm, including setup, boundary conditions, solver execution, and post-processing.
- Influence architecture, design, material selection, and structural integrity for high-performance advanced packaging and related components.
- Analyze simulation and measurement results to improve product reliability and resolve packaging issues.
- Support customers throughout product development, from thermal architecture and feasibility studies through optimization and design recommendations.
- Develop simulation methodologies, engineering standards, innovative solutions, reports, presentations, and customer reviews.
Requirements
- PhD in Mechanical Engineering, Thermal/Fluids, or a related physical science is preferred, with 10+ years of industry experience.
- Experience with CFD tools including ANSYS Icepak, Flotherm, and CELSIUS.
- Strong foundation in heat transfer, fluid mechanics, thermal management, and electronics cooling.
- Understanding of IC chip and package architectures, thermal design constraints, and SiP thermal analysis.
- Ability to independently build models, perform analysis, troubleshoot results, and develop engineering recommendations.
- Strong communication and collaboration skills for cross-functional and cross-cultural work.
Culture & Benefits
- Inclusive workplace focused on innovation, diversity, humility, kindness, and dedication.
- Medical, dental, vision, and 401(k) benefits.
- 4+ weeks of paid time off annually, plus holidays and sick leave.
- Family support benefits, including fertility and adoption stipends, medical travel support, and virtual veterinary care.
- Emotional wellness resources, including confidential therapy sessions and on-demand wellness applications.
- Onsite café and gym, virtual fitness classes, charitable giving match, and a flexible work environment.
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