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7 часов назад

Director Product Line Management (Co Packaging Optical Solution)

Формат работы
onsite
Тип работы
fulltime
Грейд
director
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Текст:
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TL;DR
Director Product Line Management (Co Packaging Optical Solution) (Photonics): Driving development and production launch of optical hardware products for high-speed optical networks with an accent on photonics packaging, reliability, qualification, and supplier coordination. Focus on managing cross-functional NPI programs, completing design verification and compliance testing, and transferring co-packaged optical solutions into volume production.

Location: San Jose, United States

Company

hirify.global is a well-funded startup building photonics infrastructure for AI supercomputing, including optical interconnects and scalable photonic engines.

What you will do

  • Drive optical hardware product development programs for high-speed optical networks from development through production launch.
  • Identify technical gaps with engineering teams and coordinate timely solutions against committed launch milestones.
  • Manage contract manufacturers and suppliers through reliability, design verification, compliance testing, and technical reporting.
  • Coordinate Photonics Design, Hardware Design, Packaging, Manufacturing, Quality Engineering, Product Marketing, and Supply Chain teams.
  • Prepare materials and technical details for customer programs, supplier discussions, engineering execution, and production release.
  • Lead technical reviews, reliability reports, and risk assessments for internal and customer-facing engagements.

Requirements

  • M.S. in Electrical Engineering, Photonics, Physics, Materials Science, or a related field, or equivalent photonics reliability engineering experience.
  • Direct experience with optical systems, silicon photonics, laser technologies, and optical transceivers.
  • Strong knowledge of photonics device physics, photonics packaging, and failure mechanisms.
  • Demonstrated success supporting NPI programs and product qualification from concept through volume production.
  • In-depth knowledge of GR-468, Telcordia, JEDEC, and MIL-STD standards.
  • Strong communication and cross-functional and supplier influence skills in a fast-paced high-tech environment serving telecom/datacom markets.

Nice to have

  • Project management experience in integrated photonics packaging and optical-electrical co-design through production release.
  • Hands-on experience with design for manufacturability and cost optimization.
  • Willingness to travel to suppliers and manufacturing partners during design or production transfer.

Culture & Benefits

  • Ground-floor opportunity at a well-funded startup developing photonics infrastructure for AI supercomputing.
  • Autonomy and significant ownership in a company targeting a multi-billion-dollar market.
  • Competitive salary commensurate with experience.
  • Professional development opportunities and certification support.
  • Access to cutting-edge technology and cloud platforms.
  • Collaborative environment with multidisciplinary and cross-functional teams.

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