SoC Chip Lead (FPGA/SoC)

Location: San Jose, California, United States

Base pay: $248,400 annually, plus potential variable or incentive compensation and equity.

Company

hirify.global develops low-power programmable logic solutions, including FPGA, CPLD, and programmable power management devices.

What you will do

• Lead development of FPGA and ASSP MCMs using 2.5D/3D advanced packaging and chiplet-based architectures.
• Own chip tape-out, signoff, quality, and production release across multiple program generations.
• Translate product requirements into SoC priorities, architectural tradeoffs, micro-architecture, and RTL decisions.
• Lead cycle-approximate performance modeling and quantify compute, memory bandwidth, and interconnect tradeoffs.
• Own system-level debug across floor planning, power distribution, clocking, timing closure, and signal and power integrity.
• Define IP roadmaps, benchmark competing solutions, present technology roadmaps to executives, and apply agentic AI methodologies to accelerate design execution.

Requirements

• BS, MS, or PhD in Electrical or Computer Engineering.
• 20+ years of FPGA/SoC design experience and a track record delivering programs from concept through tape-out and production.
• Expertise in SystemVerilog, synthesis, static timing analysis, high-speed interfaces, system interconnects, processor subsystems, and chiplet-based architectures.
• Experience with system-level functional and performance modeling, RTL correlation, emulation-based pre-silicon validation, verification, and system validation.
• Experience defining DFx methodology, including scan, BIST, and manufacturing test from IP through chip level.
• Ability to lead geographically distributed, cross-functional engineering teams and present to executive leadership. Successful background and reference checks and proof of the right to work in the United States are required.

Culture & Benefits

• Results-oriented, team-first environment across international locations.
• Healthcare and retirement plans may be included in the benefits package.
• Paid time off and other competitive benefits are available.
• Eligible for variable or incentive compensation and equity.