Advanced Packaging Supplier Technology Development Program Manager (Semiconductor)

TL;DR

Advanced Packaging Supplier Technology Development Program Manager (Semiconductor): Managing supplier capacity expansion and process tool qualification for advanced heterogeneous packaging technology with an accent on project management, technical risk assessment, and stakeholder coordination. Focus on driving yield-enabling plans, facilitating technical capability transfers, and ensuring on-time production ramp-up in a complex, matrixed environment.

Location: Must be based on-site in Phoenix, Arizona

Salary: $133,800–$255,200 USD

Company

hirify.global is a global leader in semiconductor manufacturing, driving innovations in AI, cloud-to-edge technology, and advanced packaging solutions.

What you will do

• Define process tool requirements and production line qualification plans with internal teams and suppliers.
• Execute capacity expansion projects through systematic planning and milestone tracking.
• Drive yield-improvement plans and monitor ramp indicators to ensure incident-free production.
• Facilitate technical capability transfer from internal pilot lines to supplier manufacturing lines.
• Resolve technical and logistical bottlenecks that threaten quality or delivery schedules.
• Provide regular progress updates to management and cross-functional stakeholders.

Requirements

• PhD with 3+ years or Masters with 5+ years of relevant experience in Materials Science, Mechanical, Electrical, or Chemical Engineering.
• Demonstrated experience achieving integrated process, materials, and tool hardware development milestones.
• 2+ years of experience with advanced semiconductor packaging or substrates.
• Strong understanding of process building blocks like laser drilling, lithography, and electrolytic plating.
• Proficiency in DOE, PCS, and SPC methodologies.
• Ability to manage cross-functional teams across multiple time zones and cultural contexts.

Nice to have

• Experience qualifying or owning process tools in TD or HVM contexts.
• Direct prior process qualification experience with semiconductor packaging suppliers.
• Language skills relevant to supplier geographies.

Culture & Benefits

• Competitive total compensation package including stock bonuses.
• Comprehensive health, retirement, and vacation programs.
• Opportunities to work on cutting-edge AI and semiconductor manufacturing technology.
• Global collaborative environment with a focus on ethical hiring and RBA compliance.