Optoelectronic IC Package Design Director

TL;DR

Optoelectronic IC Package Design Director (Optoelectronics): Lead package development for custom in-house photonic, analog, and digital ICs supporting next-generation optical modules with an accent on advanced package selection, BGA configuration, and package structure. Focus on SI/PI and RF performance optimization, design verification and tapeout, and cross-functional coordination across feasibility and silicon floor plan trade-offs.

Location: New Providence - NJ

Salary: $235,600 - $376,400 (annual)

Company

hirify.global is a technology company focused on high-speed connectivity and a people-first culture.

What you will do

• Own and drive advanced package selection, new product BGA configuration, and package structure.
• Own and manage package development schedules from concept through tapeout.
• Lead package layout, SI/PI optimization, design verification, and tapeout readiness.
• Coordinate with cross-functional groups on package selection, feasibility analysis, and design trade-offs.
• Simulate and optimize signal/power integrity and RF performance of the package design.
• Interface with CMs and vendors for sourcing existing designs and supporting future product development.

Requirements

• BS in Electrical Engineering or Physics (master’s or Ph.D. is a plus).
• 10+ years of hands-on experience in IC package design.

Nice to have

• Substrate design experience for RF, digital, high-speed, and mixed-signal designs.
• Strong understanding of signal and power integrity fundamentals.
• Experience with Advanced Package Designer (APD) and/or SIP and/or Xpedition Package Designer (XPD) tools (Cadence preferred).
• Fluency in SI/PI and EM simulation tools such as SIWave and HFSS.
• Experience with manufacturing electrical reviews and SI/PI analysis.
• Experience with thermal and mechanical design; familiarity with 2.5-D IC and 3-D IC interposers.

Culture & Benefits

• People-first culture with emphasis on flexible work environment, growth, well-being, and belonging.
• Comprehensive benefits including medical, dental, and vision plans.
• 401(K) (USA) & DCPP (Canada) with company matching, plus ESPP and EAP.
• Company-paid holidays, paid sick leave, and vacation time.
• Discretionary incentive bonus for non-sales roles; sales commission for sales roles.

Hiring process

• Interviews to assess technical depth in IC package design and simulation/verification experience.
• Evaluation of cross-functional coordination and ability to drive package development through tapeout.